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TELF AG Provides Insights into the Tin Market Dynamics

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October 18, 2023
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TELF AG, in its latest publication, titled “TELF AG comments on the trends of global tin market,” offers commentary on the trends within the global tin market, with a particular focus on recent significant price declines. The publication delves into the potential factors contributing to this performance while also presenting hypotheses regarding the expected recovery for the upcoming year and the broader medium to long-term outlook.

The publication begins with a general overview of the applications of tin, highlighting its crucial role, particularly in the electronics sector. Tin is a fundamental raw material for semiconductor production, an essential component of electronic devices and household appliances used daily by millions of people.

TELF AG also underscores an intriguing aspect of chip production, noting that the demand for these vital electronic components is projected to surge in the coming years, reaching remarkable levels by 2030. By that time, the global demand for chips and semiconductors is anticipated to necessitate the production of nearly 200 chips for each person on Earth.

The decline in tin prices can be attributed in part to reduced demand for electronic devices resulting from the global easing of COVID-19 restrictions. During the height of the pandemic, there was a significant increase in demand for devices, leading to a parallel uptick in requests for the raw materials required to manufacture their essential components, including tin. The publication suggests that this decline is temporary and closely tied to the unique circumstances of the moment, namely, people spending less time at home and in close proximity to their electronic devices.

Furthermore, TELF AG mentions other potential factors contributing to the overall drop in tin prices, such as the ongoing slowdown in global economic growth, as well as specific structural issues observed in China and Japan, two major global semiconductor exporters.

For more detailed information, the full publication is available to read on the TELF AG website.

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